| Yamato PDC210 Parallel Electrode Type Plasma for Reactive Ion Etching (RIE) |
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The purpose of Yamato PDC210 is to remove organic films and clean/reform/etch surfaces. The unit uses two reaction gas systems: 1) Oxygen (O2) and a mass flow controller (500 secm); and 2) Argon (Ar2) and a mass flow controller (100 secm). The purge gas system consists of Nitrogen and a regulator (3 kgf/cm2).
The PDC210 uses the Reactive Ion Etching (RIE) plasma mode. With the use of options, this model can also be used for Direct Plasma (DP) cleaning. It has a high-frequency output of 300W and an oscillating frequency of 13.56 MHz. Its aluminum chamber measures 15.75W x 9.84D x 5.91H inches.
The safety mechanism to protect the system includes: - Vacuum Pump and RF Generator to watch over current using Thermal Protector Magnetic relay.
- Product Quartz Oscillator is protected when mismatching of units occurs.
- Door Panel Interlock.
Applications for Plasma:
Plasma can be used to clean silicon wafers, PCB/substrates, plastics, polyimid resins, carbons, metals, fine ceramics, glass or rubber materials, and fibers. For example, ashing, etching, and cleaning are applicable in wafer processing; substrate cleaning, pre-wire bonding, and pre-molding are applicable in IC packaging.
Specific applications of plasma cleaning equipment are:
- Improving adhesion strength of surface package density (e.g., IC assembly).
- Ashing/Etching.
- Removing oxide film on metal surface (semiconductor).
- Residue removal (semiconductor wafer).
- Cleaning prior to glass film coating (optical parts).
- Improving adhesion strength of Polymeric materials (electronics and medicals).
- Improving adhesion strength of quartz substrates (cellular phones).
- Fine cleaning organic EL.
- Cleaning carbon products (fuel cell electrodes).
- Improving adhesion strength of resin products (automobile parts).
- Acceleration test for materials (building materials).
Shipping Terms: FOB Santa Clara, CA, via truck delivery. Shipping charges, including packaging, crate, and pallet, are based on dimensional weight. Please call us at (408) 265-6482 for a shipping quote (with insurance).
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| Main Unit: | | | Aluminum Chamber: | Internal dimension: 15.75W x 9.84D x 5.91H inches. | | Electrode (Stage Dimensions): | Parallel flat stage plate: 9.8W x 6.7D inches. | | Vacuum Gauge: | Capacitance manometer | | Reaction Gas System: | Two systems: (Argon and Oxygen) | | Controller: | Programmable controller | | Display: | LCD touch panel display | | Radio Frequency Supply: | | | Input: | AC 200V, Three-phase, 15A (50/60 Hz). | | Radio Frequency Output Power: | 500W | | Reference Oscillator: | Quartz oscillator | | Matching Adjustment: | Automatic Tuning | | Discharge System (Vacuum Pump) only | PCD210 Optional | | Displacement: | Total 345 liters/minute | | Input Power Supply: | Three phases, AC200V, 4A, 50/60 Hz. | | Inlet Configuration: | NW25 | | Outlet Configuration: | NW25 | | Gas Systems: | | | Reaction Gas G1: | Oxygen and a mass flow controller (500 secm). | | Reaction Gas G2: | Argon and a mass flow controller (100 secm). | | Required Utilities: | | | Power Supply: Main Unit with Vacuum Pump: | PDC-210: Three phases: AC200V, 15A, 50/60 Hz (with an accessory power cable of 118.11 inches long, and exposed crip-style terminals of .31 inches long). | | Connection Port: | 1/4-inch Swagelok joint bulkhead union (SS-400-61). | | Note: | Pressure regulators, filters, and other protective devices shall be prepared by other manufacturers. | | Connection Diameter of the Discharge Duct: | Also Inlet Port | | Vacuum Pump (Inlet Port): | NW25 (with a flexible stainless steel hose of 39.37-inch long. | | Vacuum Pump (Outlet Port): | NW25 | | Note: | Every port has a connector designed for a flexible hose. |
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